We Sell New Laser Systems as well as Refurbished (Used) Laser Systems

Some Examples:

Circuit Isolation by Laser Trace Cutting

Laserod performs laser trace cutting down to one micron spot size. More information is available online regarding laser scribing or cutting of silicon wafers.

	If your interest is to  purchase equipment,  see our Systems Sales section

Laserod offers either YAG or Xenon "green" lasers for circuit isolation by laser severing of traces on chips, wafers or circuit boards.  The laser provides quick cutting, submicron accuracy of cut placement, cuts through passivation and metallization, and is adjustable to avoid substrate damage.  Typical usage is in failure analysis and circuit repair.

Minimum cutwidth is one micron.  Maximum is unlimited because overlapping spots of 10 microns can be laid down.  The laser has a spot marker which  outlines the size, shape, and location of the laser cut before the cut is made, thus ensuring precision work.

One Micron Trace Severed Circuit Isolation by Laser Trace Cutting: One micron lines and spaces (unpassivated).

Equipment for Circuit Isolation

The Model Del-31, shown below with covers removed, was supplied to a major corporation for isolation of copper traces on a FR4 dielectric substrate.   It is a water cooled, frequency doubled, 50Hz green YAG New Wave laser.  Del-31 is capable of up to 31"  X-travel in a compact footprint. 

Laserod Model Del-31 Laser Delete Tool:  Motorized features in Del-31 include:  turret, focus & X-Y apertures. Open laser architecture View or obtain a catalog

 

Florod Model LFA

From 1974 to 1996 Rod Waters, Owner of Laserod, was an owner of Florod Lasers. Over that time period about 500 Model LFA were built.

An IBMer once called the LFA a "brick" laser. That's because it's so robust. The optics, for example, suffer little laser wear and tear. All you have to do is replace the Xenon laser tube every 3-5 years. Or replace the Xenon laser head by a Q-switched Nd:YAG solid-state laser head. Laserod can help you with this.. 

Current laser "zappers" shoot through a microscope video port. The LFA does not require a microscope as it already has one built-in. The laser beam strikes horizontally a 90 degree beam bender with video camera above and laser focusing objective below. The objective is typically a Mitutoyo 50X for zapping and a Mit 5, 10 or 20X for viewing. The LFA has a turret to facilitate lens changing.

Model LFA Specifications:

• Laser:  Originally Xenon (Xe) but retro-fittable to Nd:YAG

• Output: 750 w peak (Xe), 4 MW (YAG)

• Pulse Width: 0.5 to 1.0 microsec (Xe), 3-5 ns (YAG)

• Spectral Output: blue-green (Xe), 532 nm (YAG)

• Rep Rate: single shot or 1pps (Xe), 1-15 Hz (YAG)

The Following Specs are for both Xe & YAG:

• Laser Cuts: 3-10 microns wide, adjustable rectangle

• Viewing: simultaneous microscope body and video monitor

• Targeting: spot marker to outline location, shape & size of laser cut.

• Optics: 15X eyepieces with 2-3 objectives

• Power: 110VAC, single phase, 3-4a, 50/60Hz