Shop Service or Equipment Supply for Laser Machining of Silicon (cutting,
drilling, coring, resizing) as used in the
Microelectronics Industry
Laserod specializes in laser machining of silicon
(Si). We offer precision laser cutting,
scribing, coring (resizing), flat
cutting, hole drilling,
singulation and dicing of silicon and MEMS devices.
Typical applications of laser machining silicon include
the manufacture of MEMS devices,
sensors, detectors, and solar cells.
Laser Micromachining Silicon Wafers
Why Choose Lasers and Laserod for Processing
Silicon?
Lasers
can handle Silicon's delicate structure.
Si is brittle, has a crystalline structure, and has a
high vaporization temperature, none of which present a
problem to laser machining. For example crystalline
direction is of no hindrance to the laser.
Lasers
enjoy advantages over traditional machining methods.
Lasers cut circles
of almost any size so coring (resizing), via (hole)
drilling are easily done. Our laser's kerf loss is
typically 30 microns with 10um optional. The laser
cutting edge stays sharp - improving yield.
We
work to low tolerances and very fine cuts.
Tolerances in our laser working of silicon run a few
microns, with fineness of our laser cuts down to 10
microns (approximate laser spot size).
High
power, high precision gives better results.
High laser power at a favorable wavelength focused to a
small spot and the beam controlled by high precision
mechanics gives superior results in cutting, scribing,
and hole drilling of silicon.
How
does Laserod do it better than their competition?
The people of Laserod have been performing high-quality
laser machining of silicon for over 20 years. Our
quality and turn-times are among the best -- performed
at very competitive prices.
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