Silicon Laser Machining (cutting, drilling, resizing)
Laserod specializes in laser machining of silicon (Si).
We offer precision laser cutting,
scribing, resizing, flat
cutting, hole
drilling, singulation and dicing of silicon and MEMS
devices. Typical applications of laser machining silicon
include the manufacture of
MEMS devices, sensors, detectors, and
solar cells.
Laser Micromaching Silicon Wafers
WHY CHOOSE LASERS AND LASEROD FOR PROCESSING SILICON?
Lasers
can handle Silicon's delicate structure.
Si is brittle, has a crystalline structure, and has a high
vaporization temperature, none of which present a problem
to laser machining. For example crystalline direction is of no
hindrance to the laser.
Lasers
enjoy advantages over traditional machining methods.
Diamond scribes and saws are traditionally used in straight-line
silicon machining. Lasers can cut circles or any shape.
Our laser's cutting edge is 10-30 microns, substantially less than EDM.
We
work to low tolerances and very fine cuts.
Tolerances in our laser working of silicon run a few microns,
with fineness of our laser cuts down to 5 microns (approximate laser spot size).
High
power, high precision gives better results.
High laser power at a favorable wavelength focused to
a small spot and the beam controlled by high precision
mechanics gives superior results in cutting, scribing,
and hole drilling of silicon.
How does Laserod do it better than their competition?
The people of Laserod have been performing high-quality laser machining of silicon for over 20
years.
Our quality and turn-times are among the best -- performed at very competitive
prices.
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