Laser MicroMachining MEMS Devices
Laser Cutting, Scribing, Singulation and
Dicing of Silicon (MEMS) Substrates
Laserod has been enjoying some success in laser machining of MEMS devices.
MEMS are MicroElectroMechanicalSystems. MOEMS are optical MEMS. Then there
are RF MEMS, bioMEMS, sensors, etc. For us, MEMS are always on silicon
substrates, are 3-dimensional, are sensitive to debris and tend to be very
fragile.
Here are a three reasons why our laser machining of MEMS is useful and why Laserod should be your vendor of choice:
- We
have some of the highest tech laser equipment to get "clean" results
in MEMS processing.
- Our
lasers enjoy spot sizes typically in the range 10-25 microns.
- Clean
room processing.
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Laser drilled small hole in silicon MEMS device.
No debris, no cleaning.
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Precision Laser Work:
Examples of
microelectronic micromachining of MEMS devices include cutting, scribing,
drilling, singulation and dicing. We also laser saw,
laser ablate, laser etch and microdrill vias in
semiconductor/MEMS wafers and chips including RF MEMS,
bioMEMS,
sensors, transducers, etc. To this list you can add laser patterning thin
metallic layers.
Advantages of our laser micromachining of MEMS devices are minimal laser
debris and laser burning. Little or no cleaning is required. More detailed
information about MEMS machining and samples of our work are available on our
website.
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